Transcend's M.2 SSD MTE670T features state-of-the-art 3D NAND technology, which allows 112 layers of 3D NAND flash chips to be vertically stacked. Compared to 3D NAND at 96 layers, this density breakthrough greatly improves storage efficiency. The MTE670T features the PCI Express (PCIe) Gen 3 x4 interface and is compatible with NVM Express (NVMe) 1.3 specifications to achieve never-before-seen transfer speeds. Applied with the 30µ" gold finger PCB and Corner Bond technology, the MTE670T is fully tested in-house to guarantee reliability in mission-critical applications, boasting an endurance rating of 3K Program/Erase cycles and an extended operating temperature ranging from -20~75. Transcend also offers the MTE670T-I with wide temperature (-40 ~ 85) capabilities to ensure sustained functionality, enhanced endurance and optimal reliability in mission-critical applications. Weight & dimensions Width: 80 mm Depth: 22 mm Height: 2.23 mm Weight: 9 g Power Operating voltage: 3.3 V Power consumption (average): 3.1 W Power consumption (idle): 0.4 W Operational conditions Operating temperature (T-T): -20 - 75 °C Storage temperature (T-T): -40 - 85 °C Operating relative humidity (H-H): 5 - 95% Storage relative humidity (H-H): 5 - 95% Operating vibration: 20 G Operating shock: 1500 G Other features Compliance certificates: CE, RoHS Features SSD capacity: 512 GB SSD form factor: M.2 Interface: PCI Express 3.0 NVMe: Yes Memory type: 3D NAND Component for: PC NVMe version: 1.3 Read speed: 2100 MB/s Write speed: 1600 MB/s Random read (4KB): 150000 IOPS Random write (4KB): 280000 IOPS PCI Express interface data lanes: x4 S.M.A.R.T. support: Yes TRIM support: Yes ECC: Yes Mean time between failures (MTBF): 3000000 h TBW rating: 960 SSD usage tag: EmbeddedNäytä lisääNäytä vähemmän
